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Intel's Project Firefly: Breaking the Laptop Cooling Mold
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Intel's Project Firefly: Breaking the Laptop Cooling Mold

A radical new laptop design from Intel ditches traditional cooling vents entirely, adopting a phone-like 12.9mm metal chassis—but can passive heat dissipation hold up under enterprise workloads?

Last updated 50 minutes ago • Intel's Project Firefly: Breaking the Laptop Cooling Mold
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