Arm reports record revenue growth, driven by architectural efficiency gains that address thermal constraints while maintaining performance, signaling a broader industry transition.
A new memory interface standard is quietly becoming the backbone of AI servers, but its long-term impact on perform...
A temporary price drop on Windows 11 Pro to just $9.97 challenges traditional enterprise software pricing and could...
The latest JEDEC LPDDR6 standard introduces 512 GB capacities and SOCAMM2 modules, targeting high-performance AI wo...
The new Apex Manifold 360 redefines custom water-cooling with four chambers, eight G1/4 ports, and integrated aRGB...
TSMC's latest process nodes for 2029 aim to bypass the most expensive EUV tools from ASML, signaling a shift in sem...
The 14A process node, built at Intel's TeraFab facility, delivers incremental gains over 18A while positioning the...
A former PlayStation executive argues that PC ports are a cost-effective strategy for Sony, helping recoup developm...
The ASUS AI Inference Platform introduces a modular, thermally efficient framework for enterprise AI workloads, add...
The Rambus SOCAMM2 chipset introduces a new era of serviceable, LPDDR5X-based memory modules for AI servers, promis...
A fresh GPU generation delivers a 20% efficiency leap, but thermal management and an unclear long-term vision may l...
