Latest articles, news and analysis in the GPU category.
Endorfy has launched its first microATX case lineup, the Signum M30, blending high-end cooling flexibility with a space-saving design. The two models—ARGB and Air—support GPUs up to 345mm, seven fans, and a USB-C port with 20Gb/s speeds, catering to gamers and creators who demand performance without...
A leap in extreme ultraviolet (EUV) light production could supercharge semiconductor manufacturing—but the industry won’t see its full impact until the end of the decade. Here’s what’s changing and why it matters.
AMD has struck a landmark deal with Meta, offering customized AI infrastructure worth up to $30 billion—equivalent to 20% of its market valuation. The partnership includes next-gen CPUs, GPUs, and a performance-based equity stake, signaling AMD’s aggressive push into hyperscale AI computing.
A bold new alliance between ASUS Republic of Gamers and Kojima Productions introduces a limited-edition gaming lineup—from a 96GB RAM 2-in-1 PC to peripherals inspired by the studio’s iconic Ludens aesthetic. Here’s what sets these products apart.
A new power management hub lets enthusiasts and test labs daisy-chain up to five power supplies into a single system, with granular on/off control and LED status indicators—all for under $70.
Google has rolled out Chrome 145.0.7632.116/117 for desktop and 145.0.7632.120 for Android, addressing three high-severity vulnerabilities—including memory corruption risks in media and WebGPU, plus an implementation flaw in DevTools. No active exploitation has been reported, but admins should prior...
A newly filed patent reveals Sony’s next-gen PSSR upscaler will dynamically adjust AI workload in real-time to prevent stuttering—potentially unlocking stable 4K/120 FPS performance without sacrificing visual quality.
FinalWire’s latest iteration of AIDA64 introduces native NVMe driver support, refined SensorPanel controls, and expanded hardware monitoring—including MSI’s flagship PSUs and external LCDs. The update also debuts a command-line tool for enterprise deployments, though its advanced features remain loc...
The Abxylute 3D One’s glasses-free 3D display is its most talked-about feature, but the device’s modular design and productivity strengths may overshadow its gaming limitations. A closer look reveals a machine that could redefine handheld computing—if the 3D experiment doesn’t distract from its core...
NVIDIA’s first Arm-powered laptop chips, codenamed N1 and N1X, could debut as early as mid-2026, targeting ultra-thin designs with integrated CPU, GPU, and AI acceleration. But will they finally arrive at GTC 2026—or will delays push them further into the year?
SambaNova’s new SN50 chip promises five times the compute of competitors, a $350M funding boost, and a deep partnership with Intel—but industry skepticism lingers over whether it can crack GPU dominance in AI inference.
AMD and Meta are scaling their collaboration to deploy six gigawatts of AI-optimized hardware, including a custom MI450 GPU and 6th Gen EPYC CPUs, while tying revenue growth to performance milestones. The partnership marks a major step in building next-gen AI infrastructure.
A high-power BIOS flash on an ROG Astral RTX 5090 melted a Thermal Grizzly Wireview PRO connector, even as the device issued repeated temperature alerts. The incident underscores the risks of pushing GPUs beyond their designed limits—especially when critical safeguards are ignored.
New benchmarks reveal that even Apple’s high-end M4 Pro chips with 16GB of unified memory can’t sustain stable frame rates in demanding games like Cronos: The New Dawn, forcing the system to rely on SSD swapping—a bottleneck that may deter gamers from adopting the platform.
ASUS has launched a liquid-cooling alliance and custom solutions for AI and HPC data centers, targeting NVIDIA’s NVL72 systems while improving energy efficiency and rack density. The move follows real-world deployments like Taiwan’s first fully liquid-cooled AI supercomputer, with participation at N...
ASUS has rolled out a suite of optimized liquid-cooling solutions—direct-to-chip, in-row CDU, and hybrid designs—to tackle the thermal and power demands of AI supercomputers. Backed by a global partner ecosystem, these systems are already powering Taiwan’s first fully liquid-cooled NVL72 deployment...
AMD’s latest Ryzen 9000 series processors, the Ryzen 9 9950X3D and Ryzen 7 9850X3D, bring back the 3D V-Cache technology with a twist—this time, optimized for AI workloads and gaming. But does the hype match reality? A closer look at what’s truly different—and who benefits.
TSMC and Huawei are dismissing 3D packaging for smartphone SoCs, citing insurmountable thermal challenges. Instead, the focus shifts to refining 2nm processes and alternative cooling solutions like Samsung’s Heat Pass Block—leaving Apple as the sole potential adopter of advanced packaging, but even...
