Rambus introduces a new approach using time division multiplexing to tackle the data bandwidth challenges in PCIe 7.0, aiming to significantly improve performance for AI workloads and high-speed data transfers.
Global wafer prices have risen sharply in recent months, prompting semiconductor manufacturers to overhaul their pr...
Samsung is slashing its high-bandwidth memory development timeline in half, aiming to ramp up production for AI chi...
NVIDIA's latest GPU lineup, featuring the RTX 5080 with 24 GB of memory and the RTX 5070 with 18 GB, is poised to r...
Apple is set to enter a new era of semiconductor innovation with sub-1 nanometer chips, potentially as early as 202...
The MI450 Instinct GPU, designed for AI workloads, delivers significant performance gains while maintaining energy...
AMD’s RDNA 5 architecture, slated for a 2027 release, is poised to challenge performance benchmarks with a focus on...
A high-profile chip industry executive joins Intel’s foundry business, signaling a renewed focus on competing in th...
Lexar's new ARMOR 700 Portable SSD and SILVER PLUS microSDXC card target professionals with massive storage needs,...
Valve's latest Proton update introduces Wine 11 performance gains, including NTSync kernel driver support, while al...
Capcom’s sci-fi action adventure PRAGMATA is now available via NVIDIA GeForce NOW, offering cloud gaming without ha...
