A new architecture approach, APX, promises to deliver significant performance gains without the usual tradeoffs of higher power or die area. Intel and AMD are working together on this development, which could r...
The latest JEDEC LPDDR6 standard introduces 512 GB capacities and SOCAMM2 modules, targeting high-performance AI wo...
The new Apex Manifold 360 redefines custom water-cooling with four chambers, eight G1/4 ports, and integrated aRGB...
TSMC's latest process nodes for 2029 aim to bypass the most expensive EUV tools from ASML, signaling a shift in sem...
The 14A process node, built at Intel's TeraFab facility, delivers incremental gains over 18A while positioning the...
A former PlayStation executive argues that PC ports are a cost-effective strategy for Sony, helping recoup developm...
The ASUS AI Inference Platform introduces a modular, thermally efficient framework for enterprise AI workloads, add...
The Rambus SOCAMM2 chipset introduces a new era of serviceable, LPDDR5X-based memory modules for AI servers, promis...
A fresh GPU generation delivers a 20% efficiency leap, but thermal management and an unclear long-term vision may l...
The latest quarterly results from SK hynix reveal a memory market in transition, with DRAM prices stabilizing after...
The ASUS ROG Zephyrus Duo, G14, and G16 laptops combine high-end GPUs and CPUs with advanced displays, targeting cr...
