Tuesday, February 10th 2026 Amkor to Significantly Boost Arizona Packaging Capacity for Intel and TSMC by AleksandarK Today, 11:12 Discuss (0 ) Amkor is preparing to greatly expand its Arizona-based operations, and the company will boost its spending not by a few percent, but by several multiples. The company is planning to triple its capital expenditures next year, with a dramatic increase from roughly $900 million in 2025 to as much as $3 billion in 2026, betting on massive demand from Intel and TSMC packaging technologies. This includes working with Intel and TSMC to enable their most advanced technologies like EMIB and CoWoS, all of which come in various form factors. We previously reported that Intel partnered with its long-time OSAT partner Amkor to take additional EMIB capacity that Intel's customers are interested in, in Incheon, South Korea. However, as Amkor expands its facilities in Arizona, Intel will also collaborate with Amkor to deliver advanced EMIB packaging types on United States soil. While TSMC has been a primary choice for many high-density assemblies, growing interest in Intel's EMIB and Foveros options has led partners like MediaTek, Google, Qualcomm, and Tesla to consider alternatives. Interestingly, Amkor will also offload some of the CoWoS packaging work from TSMC by creating CoWoS packages on U.S. soil, instead of sending these chips back to TSMC's Taiwan fabs to finish production. Both CoWoS and EMIB/Foveros offer a list of benefits, making them highly sought-after packaging technologies for companies seeking to extract maximum performance from their chips. Amkor plans to be at the center of that supply chain and help Intel and TSMC handle more customers. Source: ComputerBase Related News Tags: Amkor Arizona CoWoS EMIB Foveros Intel partners production supply chain Taiwan TSMC United States Oct 26th 2025 Intel's Advanced Packaging Could Be America's Answer to Silicon Dominance (25) Nov 18th 2025 AMD & NVIDIA Reportedly Consider GPU Cuts, ASUS and Others Slow Motherboard Plans Amid Memory Shortage (36) Dec 18th 2025 NVIDIA and AMD Explore Intel 14A Node, Apple and Broadcom Considering Intel EMIB Packaging (6) Dec 24th 2025 Intel's Fab 52 is Bigger Than TSMC Arizona, Produces More Than 40,000 Wafers Per Month (20) Dec 1st 2025 Intel and Amkor Team Up to Scale EMIB Packaging Production (5) Oct 1st 2025 Intel Reportedly Begins 18A Production in Arizona, Panther Lake Reveal Set for Oct. 9 (3) Oct 18th 2025 Intel Foundry Reportedly Secures 18A Order from Microsoft for Maia 3 Accelerator (13) Dec 4th 2025 ASRock H610M COMBO Motherboard Accepts DDR5 & DDR4 DIMMs (8) Jan 31st 2026 Apple M5 Pro and M5 Max To Launch in March With New SoIC Packaging To Cut Costs (4) Oct 21st 2025 NVIDIA's Arizona-Made Blackwell GPUs Must Travel Back to Taiwan for Packaging (12) Add your own on Amkor to Significantly Boost Arizona Packaging Capacity for Intel and TSMC There are no yet.
