ATP Electronics has introduced the world’s smallest eMMC storage solution at just 6.7mm, marking a significant leap forward for smart wearables like augmented reality glasses.
The E700Pc and E600Vc series, built on a 125-ball Fine Ball Grid Array (FBGA), reduces footprint by 67% compared to conventional eMMC packages while preserving key performance metrics. This miniaturization allows for seamless integration into ultra-slim wearable devices without compromising speed or endurance.
One of the standout advantages is its power efficiency, with ATP’s firmware tuning enabling up to 70% power conservation in active-to-idle transitions. The device supports JEDEC e.MMC 5.1 standards, including High Speed 400 (HS400) DDR Mode for bandwidths reaching 400 MB/s, ensuring compatibility with existing wearable architectures.
However, the trade-off comes in capacity options. While a native triple-level cell (TLC) variant offers 64 GB storage, the E700Pc provides only 20 GB with pseudo single-level cell (pSLC) technology—ideal for endurance-critical applications but limiting for high-storage demands.
Thermal resilience and vibration resistance further enhance its suitability for mobile and outdoor use, operating reliably between -25°C and +85°C. The soldered-down design also mitigates wear from constant movement, a common challenge in wearable devices.
The 6.7mm eMMC is positioned as a solution for next-generation smart glasses, where space constraints and battery life are paramount. ATP is collaborating with wearable manufacturers to validate proof-of-concept designs, emphasizing its role in enabling more compact and efficient form factors.
