Huawei’s next-gen Kirin chip, codenamed 'Mate 90,' is said to leverage TSMC’s advanced 3nm process, positioning the company for a competitive push against Apple in the iPhone 18 cycle. The move signals Huawei's...
Cooler Master has unveiled two advanced cooling solutions designed to address thermal challenges in next-generation...
ZutaCore is betting big on a radical shift away from water-based cooling in AI data centers, deploying $100 million...
Arctic introduces the Freezer 61 air cooler, modular BioniX fans, a smart fan controller, and the Xtender Mini case...
The DDR5 memory market is at a crossroads, with rising prices forcing PC builders to balance cutting-edge performan...
AMD has yet to commit to bringing its advanced upscaling tech, FSR 4.1, to RDNA 3.5-based APUs, leaving the future...
The Exynos 2600's unit price surge to $270 has forced Samsung Mobile to reconsider its chip sourcing, with implicat...
AMD's approach to FSR 4.1 in its RDNA 3.5 integrated GPUs is creating strategic tension, as industry players weigh...
Valve’s co-founder outlines the company’s strategy to adapt to a more competitive game distribution landscape, bala...
The upcoming Tomb Raider game demands significant hardware, with the recommended NVIDIA RTX 3080 and AMD Radeon RX...
A 15 kW single-phase direct liquid cooling coldplate demonstrates that stability and simplicity can coexist with hi...
