Embedded computing has reached a new frontier with Congatec’s latest lineup of Core Ultra Series 3-powered modules, designed to accelerate AI workloads at the edge without the need for dedicated accelerators. The company has introduced five new Computer-on-Modules (COM)—three in COM-HPC form factors and two in COM Express—each built around Intel’s Panther Lake-H architecture. These modules promise a leap in performance, with some configurations capable of handling up to 180 TOPS of AI processing power.
The flagship MC1000 module, sized at 55 x 84 mm (COM Express Type 10), supports up to 32 GB LPDDR5X memory with speeds reaching 8,533 MT/s, soldered directly to the board for reliability in compact deployments. For applications requiring greater memory capacity, the TC1000 and TC1000r modules—both conforming to 95 x 95 mm COM Express compact dimensions—offer dual SODIMM sockets for 64 GB DDR5 (up to 7,200 MT/s), expandable to 128 GB in total. The TC1000r takes a different approach with 96 GB LPCAMM2 LPDDR5x memory, also peaking at 8,533 MT/s, catering to low-power, high-bandwidth needs.
The largest module in the lineup, the HPC/cPTL (95 x 120 mm), targets client-sized embedded systems with an LPCAMM2 socket supporting up to 96 GB LPDDR5X at 7,466 MT/s. Meanwhile, the SWaP-C optimized HPC/mPTL (95 x 70 mm) delivers 96 GB LPDDR5X at the same speed, emphasizing efficiency in space-constrained environments.
Key specsProcessor: Intel Core Ultra Series 3 (Panther Lake-H), including the Core Ultra X9 388H APU for peak AI performance.Memory:MC1000: 32 GB LPDDR5X (soldered, up to 8,533 MT/s).TC1000: 64 GB DDR5 (dual SODIMM, up to 7,200 MT/s), expandable to 128 GB.TC1000r: 96 GB LPCAMM2 LPDDR5x (up to 8,533 MT/s).HPC/mPTL: 96 GB LPDDR5X (up to 8,533 MT/s).HPC/cPTL: 96 GB LPCAMM2 LPDDR5X (up to 7,466 MT/s).Form Factors:MC1000: 55 x 84 mm (COM Express Type 10).TC1000/TC1000r: 95 x 95 mm (COM Express compact).HPC/mPTL: 95 x 70 mm (COM-HPC mini).HPC/cPTL: 95 x 120 mm (COM-HPC Client Size A).AI Performance: Up to 180 TOPS (enabled by integrated Xe3 graphics and NPU).Target Applications: Edge AI, industrial automation, ruggedized computing, and high-performance embedded systems.
These modules address a growing demand for integrated AI processing in embedded systems, where discrete accelerators add cost and complexity. By embedding 180 TOPS of performance into a credit-card-sized package, Congatec’s lineup simplifies deployment for industries like robotics, medical imaging, and smart infrastructure. The LPDDR5X and DDR5 configurations ensure flexibility—whether prioritizing low-power efficiency or high-bandwidth throughput.
Pricing and broader availability details remain under wraps, but the modules are now accessible for custom configuration and quoting through Congatec’s product pages. The announcement follows Intel’s Core Ultra Series 3 launch earlier this year, positioning these modules as a key enabler for next-generation embedded AI applications.
